In the era of on-device AI, the demand for 3D NAND Flash is surging. But as the industry prepares to scale beyond 400 layers, and go to 1,000 layers over the next decade, it introduces a set of challenges for chipmakers. Leading semiconductor equipment maker Lam Research has innovative solutions to help chipmakers with etch and deposition technologies. In the latest Counterpoint Conversations episode, our VP of Research, Neil Shah, had an insightful conversation with Harmeet Singh, Group VP & GM of Etch, Lam Research. Singh shed light on how the industry is pushing the envelope of memory density and performance.
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