Reballing of BGA chips with pyramids without stencil soldering fat and soldering iron
Analysis of errors when reballing BGA chips with a soldering iron and a heat gun.
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The author of the video did not use stencils due to their absence and filled the balls with a soldering iron with subsequent melting of heat gun. All soldering was on the phone with the help of soldering grease.
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Watch video Reballing of BGA chips with pyramids without stencil soldering fat and soldering iron online, duration hours minute second in high quality that is uploaded to the channel Технологии производства электроники 12 May 2020. Share the link to the video on social media so that your subscribers and friends will also watch this video. This video clip has been viewed 8,065 times and liked it 792 visitors.
